热管理中心

Numerical simulation of ducted pin fin heat sink © 2006 Melanie Beauchemin

The 热管理中心 Research at 菠菜网lol正规平台 has two primary goals:

  • serving the engineering community by performing applied research
  • fostering students' understanding of the thermal management of electronics and other 设备.

这个实验室的主任是李博士. 妮可冈本. 如果你。请联系她中的任何一个 would like to discuss sponsorship of a project. 项目 partners have included Hewlett Packard, Cisco Systems, Apple Computer, Therma, Inc.洛克希德·马丁公司，太空系统公司 Loral, the National 科学 Foundation, and the California Energy Commission.

功能

扫描电子显微镜

扫描电子显微镜 of a lead-free, fluxless solder joint from copper to metallization for synthetic diamond (金,P, et al. ©2008 asme)

我们目前的专长包括:

  • numerical modeling of electronic systems requiring thermal management  
  • experimental testing of electronic comp一个nts and systems cooled using single-phase 对流(空气和液体)  
  • cooling of high heat density electronics  cooling at high elevations  design and testing of advanced thermal interface materials  
  • micro heat pipe analysisheat pipe fabrication and testing  microchannel heat transfer  
  • modeling of thermal management of data centersexperimental testing of comp一个nts used 数据中心冷却  
  • 热交换器的设计和测试

实验设施

  • Approximately 1200 square foot laboratory

  • High altitude thermal testing chamber, capable of simulating altitudes of up to 80,000 ft and temperatures from ambient to 160ºC, from Thermal Product Solutions
  • amca210 -99气流试验箱 from Airflow Measurement Systems; used to measure chassis impedance, generate specified flow rates, and determine fan performance (shown 下图) 
  • 大型闭环风洞
  • Small airflow test chamber for analyzing comp一个nt-level performance, such as heat 汇.
  • Low-speed (0-2 m/s), low-turbulence intensity wind tunnel
  • National Instruments and Agilent automated data acquisition systems with a site license 为虚拟仪器.
  • 红外摄像机
  • 热界面材料测试仪
  • Ultra-high precision electronic scale
  • 3 - d打印机
  • A wide variety of standard laboratory equipment such as handheld thermocouple readers, a high-precision electronic manometer (Microtector), and pressure transducers

 计算资源

  • Academic site license for the suite of Ansys programs, including Fluent and IcePack 
  • Academic site license for solid modelling software such as Pro-E
  • Academic site license for 工程 Equation Solver (EES), a simultaneous equation solver with thermophysical properties built in that is good for thermal system analysis. 

amca210 -99气流试验箱

amca210 -99气流试验箱     

电子冷却风洞

低速风洞

小气流室

  Air-Flow Test Chamber for Comp一个nt Testing      

高空舱

高空舱

Publications Related to Thermal Management 

Flow visualization of offset-strip fin array

Flow visualization of offset-strip fin array © 1997 妮可冈本

Werdowatz,.冈本，N., and Kabbani, H, "Developing an Empirical Correlation for the Thermal Spreading Resistance of a 散热器, accepted for Proceedings of Semi-Therm, 2018.

Lam Y.冈本，N. Shabany Y. and Lee, S-J, “Experimental Investigation of Liquid Cooling through Shallow Copperclad Cavities with Etched Pin-鳍数组”, 2018, ASME FEDSM 5th Joint US-European Fluids 工程 Summer Conference Proceedings.

N冈本.蒂尼奥，我.民主党人白思豪(DiBlasio.卡尔森，J.佩蒂，C.索莫斯,., 2016, "Using Patterned Surface Wettability for Improved Frosting/Defrosting Performance," ASHRAE年会.

Yu, R.索莫斯,.冈本，N., 2013, “Effect of a Micro-Grooved Surface Design on Air-Side Thermal-Hydraulic Performance of Plain-Fin-and-Tube 热交换器。” International Journal of Refrigeration,卷. 36, No. 3, pp 1078-1089.

索莫斯,.余，R.冈本，N.Upadhyalula, K.， 2012，“冷凝水排水” Performance of a Plain-Fin-and-Tube Heat Exchanger Constructed from Anisotropic Micro-Grooved Fins,” International Journal of Refrigeration,卷. 35, No. 6, pp 1766-1778.

Yu, R.索莫斯,.冈本，N.Upadhyalula, K.， 2011，“异向异性的影响” Fin Surface Design on the Thermal-Hydraulic Performance of a Plain-Fin-and-Tube Heat Exchanger”, Proceedings of the ASME International 机械工程 Conference 博览会，丹佛，科罗拉多州.

Yu, R.索莫斯,.冈本，N.Upadhyalula, K.， 2011，“各向异性换热器” Fin Surface Design for Improved Condensate Management,” International Conference on Air Conditioning and Refrigeration, Gangwon-Do, Korea.

Nagendrappa N.冈本，N.C.巴雷兹，F., 2010 "Thermal Characterization of Fan-in Package-on-Packages," accepted for Semi-Therm 26, Santa Clara, CA.

Meakins, M.冈本，N.C.巴什，C., 2009, "An Energy and Exergy Analysis of Economizer-Based Data 中心, " Proceedings of the ASME International Energy Sustainability 会议，旧金山，加州.

辛格,年代.冈本，N.C., 2009, "Optimal Micro Heat Pipe Configuration for High Performance Heat Spreaders, " IMAPS Workshop on Thermal Management, Palo Alto, CA.

N冈本.C.Hsu, T-R和Bash, C., 2009, "A Thermal Management of Electronics Course and Laboratory for 本科s," Advances in 工程 教育,卷. 1, No. 3.

金,P.C.科佩奇，A.G.卡姆，C.C.沙湾，s.s.春，B.李，J.， 2008，“无铅， Fluxless Solder Joints to Synthetic Diamond," 2008年美国机械工程师学会会议录 International 机械工程 Congress and Exposition10月. 31-Nov.6、马萨诸塞州波士顿

Rogacs,.李，J., 2007, "Performance – Cost Optimization of a Diamond Heat 机”, Proceedings of 2007 IEEE CPMT Division, Advanced Packaging Materials Conference，圣何塞，加州，10月. 3-5.

Bhave表示N.冈本，N.C., 2007, "Modeling Noncoplanarity Effects on Thermal Performance 电脑芯片，” Proceedings of the IEEE Advanced Packaging Materials Symposium，圣何塞，加州，10月. 3-5.   

Rhee J.和巴特，A., 2007, “Spatial and Temporal Resolution of Conjugate Conduction-Convection 热阻。” IEEE Transactions on Comp一个nts and Packaging Technologies,卷. 30, No. 4, pp. 673-682

Rhee J.Hernandez, S.I., 2006, “Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards,”  ASME J. 电子产品包装,卷. 128, No. 4, pp. 484-493.

Rhee J.莫法特(R.J., 2006, "Experimental Estimate of the Continuous One-Dimensional Kernel Function in a Rectangular Duct With Forced Convection, 期刊传热,卷. 128, No. 8, pp. 811-818.

Beauchemin, M.李，J., 2006, “Investigation of Cylindrical Pin Fin 散热器s 在高海拔地区，” Proceedings of the ASME Congress and Exposition, 11月11日伊利诺斯州芝加哥. 5-10.

塞德尔,R.李，J., 2006, “Parametric Analysis of 散热器 Performance at High Altitudes with Air Impingement Cooling,” Proceedings of the ASME Congress and Exposition, 11月11日伊利诺斯州芝加哥. 5-10.

Rhee J., 2006, "The Role of Temperature Superposition in Thermal Management," Proceedings of the 11th IEEE CPMT Advanced Packaging Materials Conference亚特兰大，乔治亚州 

Bhatt,.李，J., 2006, "Thermal Spreading Resistance for Square and Rectangular 实体。” Proceedings of the 11th IEEE CPMT Advanced Packaging Materials Conference亚特兰大，乔治亚州

Heresztyn,.J.H.(DeJong 冈本, n.n).C., 2005, "Thermal Design of Microchannel 散热器s for Low-Orbit Micro-Satellites," Proceedings of the 3rd International Conference on Microchannels and Minichannels, American Society of Mechanical Engineers, Toronto.

Rhee J.Wong, G., 2004,  "Characterization of Airflow Impedance in Two Types 电信底盘，” Proceedings of the 20th Semi-Therm International Conference圣荷西，加州.  [pdf]

DeJong N冈本.C., and Hsu, T-R, 2004, "Development of a Laboratory Curriculum Devoted to the Thermal Management of Electronics," Proceedings of the ASEE Annual Conference，盐湖城. 邀请演讲.

德琼,N.C.，和A.M. Jacobi, 2003, “Heat Transfer and Pressure Drop for Flow through 有界百叶翅阵列，” Experimental Thermal and Fluid 科学, 卷. 27, pp. 237-250.

德琼,N.C.，和A.M. Jacobi, 2003, “Localized Flow and Heat Transfer Interactions 在百叶翅阵列中，” International Journal of Heat and Mass Transfer, 卷. 46, pp. 443-455.

Rhee J.阿扎尔，K., 1999, “Adjusting Temperature Data for High Altitude” 电子冷却杂志， 9月,卷. 5, No. 3. 

德琼,N.C.，和A.M. Jacobi, 1999, “Local Flow Structures and Heat Transfer in Convex-Louver 鳍数组”, 传热杂志,卷. 121, pp. 136-141.

德琼,N.C., L.W. 张.M. 雅可比,年代. 巴拉昌达尔和D.K. Tafti, 1998，《互补 Experimental and Numerical Study of the Flow and Heat Transfer in Offset Strip-Fin 热交换器。” 传热杂志,卷. 120, pp. 690-698.

德琼,N.C.，和A.M. Jacobi, 1997, “An Experimental Study of Flow and Heat Transfer in Parallel-Plate Arrays: Local, Row-by-Row and Surface Average 行为,” International Journal of Heat and Mass Transfer,卷. 40, pp.1365-1378.

德琼,N.C., M.C. 绅士，和A.M. Jacobi, 1997, “An Entropy-Based, Air-Side Heat Exchanger Performance Evaluation Method: Application to a Condenser,” 国际暖通空调杂志&R研究,卷. 3(3), pp. 185-195.

Rhee J.达内克，C.J.莫法特(R.J., 1993 “The Adiabatic Heat Transfer Coefficient on the Faces of a Cube in an Electronics Cooling Situation,” Proceedings of the 1993 International 电子产品包装 Conference纽约宾厄姆顿.

最近的项目

  • Thermal characterization of a new generation of PoP Packages
  • Optimal micro heat pipe configuration on high performance heat spreaders
  • Conjugate Conduction-Convection Thermal Management of LEDs
  • Energy and Exergy Analysis of Data Center Economizer Systems
  • Cooling Optimization of High Density Raised Floor Data 中心.
  • Eliminating the Raised Floor Configuration in a Data Center by Implementing a Single 冷却线圈.
  • Thermal Stress Analysis of a Heat Spreader and High Heat Flux Source
  • Modeling Noncoplanarity Effects on Thermal Performance of Computer Chips
  • Test Fixture for 散热器 Performance Evaluation
  • Experimental Investigation of Thermal Interface Materials
  • Airflow Impedance and Fan Configuration in PC Cooling (senior design project)
  • Thermal Control of a Low-Earth Orbit Three-Axis Stabilized Micro-Satellite using Microchannel 散热器
  • Application of Microchannel Heat Transfer Enhancement
  • Characterization of Airflow Impedance for Two Types of Telecommunications Chassis
  • Determination of Heat Transfer Coefficient using Liquid Crystal Thermography
  • Preliminary Investigation of Forced Cooling at High Altitudes
  • Using CFD to Analyze the Effect of Fluid Properties on Micro-Channel Heat Exchanger 行为

课程

In addition to basic courses in thermodynamics, heat transfer, and fluid dynamics, the 机械工程 Department offers the electives "Thermal Management of Electronics" and "电子产品包装". ME 145 电子产品包装 is taught by Dr. 弗雷德Barez. ME 145 provides an introduction to the fundamental principles of electronic packaging, materials, thermal management, shock and vibrations, EMI/RFI/ESD, fatique, reliability, 标准化的测试程序. Simple design to insure product rules and guidelines 提出了.

ME 146 Thermal Management of Electronics

The National 科学 Foundation has sponsored the development of this elective and associated lab relating to the thermal management of electronics. 网站 this course includes handouts for lab experiments as well as Powerpoint lectures, 任何人都可以使用. For additional information about any experiment, please contact Dr. 冈本. If you teach a course on this topic, we would love to post a link to your course 网页.

课程主题包括:

  • Sources of heat generation in electronics
  • 压降计算
  • Constriction and spreading resistance
  • 热应力分析
  • 电子产品的液体冷却
  • 电平标准
  • 热管
  • 蒸汽压缩系统
  • 纳米尺度传热
  • 热阻法
  • 风扇和散热器
  • 热界面材料
  • 电子设备风冷
  • 计算流体动力学
  • 数据中心的冷却
  • 热电冷却
  • RoHS (restriction of hazardous substances)
  • 温度测量方法